| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoresist stripping agent composition with which a photoresist can be stripped off without corroding Cu or Cu alloy wiring lines formed on a substrate in the process of manufacturing a wiring board for a FPD (flat panel display). SOLUTION: The photoresist stripping agent composition contains at least one kind of heterocyclic compound selected from a group consisting of maltol, 2,6-dimethyl pyrone, 4-hydroxyl-6-methyl-2-pyrone, 4-hydroxycoumarin, 2,4-dihydroxyquinoline, 2-amino-4,6-dihydroxypyrimidine, 2,4-diamino-6-hydroxypyrimidine, 2-amino-4-hydroxy-6-methylpyrimidine, 4,6-dimethyl-2-hydroxypyrimidine, uracil and 6-methyluracil, by 0.05 to 10 wt.%, primary or secondary alcanolamine by 5 to 45 wt.% and a polar organic solvent and/or water by 50 to 94.95 wt.%. COPYRIGHT: (C)2008,JPO&INPIT |
