| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem of insufficient use of emitted light of a light-emitting diode of lower surface emission type. <P>SOLUTION: In a light-emitting diode 1, an LED chip 5 is bonded to the upper surface of a translucent substrate 2 using a transparent adhesive 6, and is sealed with a translucent sealing resin 9. The surface of the translucent sealing resin 9 is covered with a reflective member 10. The reflective member 10 comprises a metal reflecting film where silver or aluminum is vapor deposited or a reflecting frame of resin containing titanium oxide. A spherically recessed part 16 is formed on the lower surface of the translucent substrate 2, and the recessed part 16 is filled with a light scattering agent contained resin 17 and a phosphor contained resin 18. As the transparent adhesive 6, a light scattering agent contained transparent adhesive 19 or a phosphor contained transparent adhesive 20 is used. The light emitted from the LED chip 5 is reflected on the reflective member 10 and scattered/dispersed in the transparent adhesive, for efficient radiation from the lower surface of the translucent substrate 2 with no waste. Thus, a light-emitting diode of low profile and high brightness is provided. <P>COPYRIGHT: (C)2008,JPO&INPIT |
