METAL BASE CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a metal base circuit board having no chipping in an insulating layer and excellent characteristics in surface discharge withstand voltage and insulating reliability. SOLUTION: There is provided a method of manufacturing a metal base circuit board in which a pushback mechanism having a force of 1.0-0.1 times the maximum shearing load is provided on an ejection portion of a press mold and a steel material having 50-80 Rockwell hardness is provided on a gap between a dice and the ground. The metal base circuit board obtained by this method includes an insulating layer having a thickness of 150-450μm. COPYRIGHT: (C)2008,JPO&INPIT