| 摘要 |
PROBLEM TO BE SOLVED: To provide an imaging module which has an imaging element and is provided with a hollow space with improved airtightness between the imaging element and cover glass. SOLUTION: The imaging module is provided with: a flexible circuit board 101 provided with a light transmitting part 102; the imaging element 103 flip-chip mounted at a position corresponding to the light transmitting part 102; metal projections 104 for electrically connecting the imaging element 103 and the flexible circuit board 101; a sealing resin 107 formed around the metal projections 104; the cover glass 105 brought into airtight contact so as to cover the light transmitting part 102; a hollow space part 106 formed by a light receiving part 103a of the imaging element 103, the cover glass 105 and the sealing resin 107; and a spacer 108 whose gas permeability is lower than that of the sealing resin 107 to surround the hollow space part 106. COPYRIGHT: (C)2008,JPO&INPIT
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