SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

A method for manufacturing a semiconductor package is provided to simplify a manufacturing process by mounting a LED chip on a base substrate of a flat structure. A base substrate(60) of a flat structure is prepared. A pattern electrode is formed on the base substrate. A light emitting element is installed on the pattern electrode. A mask(72) positioned in a predetermined distance with respect to both sides of the light emitting element is formed on the base substrate. A phosphor layer(74) is formed in a space between the masks. A curing process is performed. The mask is removed after the curing process. A reflective plate is formed on the region corresponding to the removed mask.