摘要 |
A trivalent chromium plating solution is provided to form a plating layer easily by increasing reactivity, and to increase service life of the plating solution by adding a reducing agent into the trivalent chromium plating solution. A trivalent chromium plating solution comprises 0.4 to 0.6M of a trivalent chromium compound, 0.8 to 1.2M of a complex agent for suppressing a polymerization reaction of the trivalent chromium compound in an aqueous solution, 0.8 to 1.2M of an electroplating additive for increasing electric conductivity of a trivalent chromium ion, 0.8 to 1.2M of a buffering agent for correcting potential of hydrogen(pH) of the aqueous solution, 8 to 12 g/L of a depoalrizing agent for suppressing the oxidation of the trivalent chromium ion into a bivalent chromium ion, 1 to 4 g/L of an organic additive for increasing the surface glossiness of a plating layer, and 10 to 100 ppm of a reducing agent for increasing adhesion force of the plating layer, wherein the reducing agent is formed from an inorganic material or an organic material.
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申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
KIM, MAN;LEE, JOO YUL;KWON, SIK CHOL;LEE, SANG YEOUL;KIM, DONG SOO |