发明名称 |
Lead-free solder balls and method for the production thereof |
摘要 |
Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by weight of Cu, and a balance of Sn, and they have a diameter of from 0.05 mm to 1.0 mm. The solder balls can be produced by forming a molten alloy having the above-described composition into solidified balls having a diameter of from 0.05 mm to 1.0 mm using the surface tension of the molten alloy.
|
申请公布号 |
US7425299(B2) |
申请公布日期 |
2008.09.16 |
申请号 |
US20040962747 |
申请日期 |
2004.10.13 |
申请人 |
SENJU METAL INDUSTRY CO., LTD. |
发明人 |
KATO RIKIYA;NOMOTO SHINICHI;OKADA HIROSHI |
分类号 |
C22C13/00;B22F9/08;B23K35/02;B23K35/26;B23K35/40;C22C1/04;H05K3/34 |
主分类号 |
C22C13/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|