发明名称 |
Method for assembling semiconductor switching elements and heat sink in rotary electric machine and rotary electric machine |
摘要 |
A method for assembling semiconductor switching elements and a heat sink in a rotary electric machine includes: a first step in which bare chips of the semiconductor switching elements are bonded to the heat sink using a good heat conductive bonding material; a second step which connects the bare chips to a wiring part by wire bonding; and a third step in which a resin which seals the bare chips and the wiring part is applied to the heat sink in a striding manner in a state that output terminal portions of the wiring part and fins of the heat sink are exposed to the outside of the resin.
|
申请公布号 |
US7423342(B2) |
申请公布日期 |
2008.09.09 |
申请号 |
US20050300489 |
申请日期 |
2005.12.15 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
HINO YASUNARI;AKITA HIROYUKI;KATO MASAKI;ASAO YOSHIHITO |
分类号 |
H01L23/34;H01L21/44;H01L21/48;H01L21/50;H01L23/10 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|