发明名称 Semiconductor devices with a field shaping region
摘要 A semiconductor device, for example a diode ( 200 ), having a pn junction ( 101 ) has an insulating material field shaping region ( 201 ) adjacent, and possibly bridging, the pn junction. The field shaping region ( 201 ) preferably has a high dielectric constant and is coupled via capacitive voltage coupling regions ( 204,205 ) to substantially the same voltages as are applied to the pn junction. When a reverse voltage is applied across the pn junction ( 101 ) and the device is non-conducting, a capacitive electric field, is present in a part of the field shaping region which extends beyond a limit of the pn junction depletion region which would exist in the absence of the field shaping region ( 201 ), the electric field in the field shaping region inducing a stretched electric field limited to a correspondingly stretched pn junction depletion region ( 208,209 ) and an increased reverse breakdown voltage of the device.
申请公布号 US7423299(B2) 申请公布日期 2008.09.09
申请号 US20040556802 申请日期 2004.05.06
申请人 NXP B.V. 发明人 HERINGA ANCO;HUETING RAYMOND J. E.;SLOTBOOM JAN W.
分类号 H01L29/74;H01L29/06;H01L29/40;H01L29/73;H01L29/732;H01L29/78;H01L29/861 主分类号 H01L29/74
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