| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding pretreating method performing wire bonding well performed in a posterior process even when gold plating performed on a work substrate is thinned further. SOLUTION: Before the wire bonding is performed on an electrode forming nickel plating on a thin film metal barrier used as the uppermost surface layer on a substrate such as an IC board, acid radical and hydroxyl group forming oxidation product of nickel being a trace quantity on the surface layer of the electrode are reduced and removed. |
