| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board with which wiring structure can be easily formed and the manufacturing step is simplified. <P>SOLUTION: The method is used to manufacture a wiring board, wherein a pattern wiring is formed on a board, and it includes an aerosol film formation step of forming a conductive layer by collision of aerosol and a patterning step of patterning the conductive layer by etching and form the pattern wiring including the conductive layer. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
