| 摘要 |
Applying a protective covering to a substrate involves first heating it to not more than 80 (pref., 60) deg.C, then (A) applying a curable polymeric compsn., (D) which is liq., at 20 deg. C, is curable within 24 (pref., 6) hrs., at not more than 80 (pref., 60) deg. C, and contains (i) a resin (pref., thermosetting) pref., Bisphenol A epoxy, a polyamide and a tert., amine, (ii) a curing agent, (iii) opt., a Bronsted base, 0.01-2 mol in excess of amt., to effect cure, (iv) 0.1-10 wt.% of a silane, (v) less than 5 wt.% of a solvent (pref., none). (B) Applying one or more polymeric layers, the innermost (E) of which being capable of interacting with (D). (C) Allowing (D) to cure while maintaining (E) in contact. In the absence of (iii) (D) is cured at a temp., at which the outermost layer does not melt, and if a single is applied it is shaped. |
