| 摘要 |
PROBLEM TO BE SOLVED: To provide an airtight terminal for a semiconductor device which assures the heat dissipation property of the airtight terminal, avoids a decrease in reliability for airtight characteristics, further controls an increase in the manufacturing cost. SOLUTION: The airtight terminal comprises a base which has through holes emits heat of a mounted semiconductor device to the exterior, leads which are inserted in through holes and connect the semiconductor device and an external device electrically, and sealing glasses which are formed in through holes by an airtight sealing technique so that the leads and base may be insulated electrically and fixed, to keep incomings and outgoings of air to and from through holes intercepted, wherein an alloy coat treatment containing nickel and boron is performed in inner walls of through holes. COPYRIGHT: (C)2008,JPO&INPIT
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