| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multichip semiconductor device technique which enables an inspection of a connection state between semiconductor chips and individual inspections of the built-in semiconductor chips, and suppresses the increase in the number of external terminals. <P>SOLUTION: The semiconductor chips 11, 12 mounted on a multichip semiconductor device are equipped with a plurality of connecting pads 15A, 15B, 15C, 15D including first and second connecting pads, and switching circuits 21A, 21B to which signals applied to the first pads 15A, 15C; and the output signals of the semiconductor chips are input, and each of which outputs one signal to the second connecting pad 15B or 15D by a test-mode signal. The first pads 15A, 15C are connected to an external terminal 14A and the second pad 15B of the other semiconductor chip 12, and the second pad 15D is connected to an external terminal 14B, to enable an individual inspection of each semiconductor chip and state inspection of a connection (18) between the chips, by individually operating the test-mode signal connected to each of semiconductor chips 11, 12. <P>COPYRIGHT: (C)2008,JPO&INPIT |
