| 摘要 |
A semiconductor device comprises one or more elements subjected to trimming, formed on a main surface side of a silicon substrate and that is/are to be laser trimmed, and an electrode lead of the element subjected to trimming disposed below the position of the element subjected to trimming. The electrode lead subjected to trimming comprises a diffusion layer formed in an uppermost layer of the silicon substrate. The diffusion layer is covered with a protection film made of doped polysilicon and is directly formed on the silicon substrate.
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