DOWN-SET PUNCHING DIE FOR MANUFACTURING LEADFRAME AND METHOD FOR MANUFACTURING LEADFRAME USING THE SAME

摘要

A method for manufacturing a lead frame using down-set punching die are provided to prevent the generation of cracks in a molding resin by removing effectively a burr in a stamping process. A metal disk(10a) as a raw material of a lead frame is provided. A stamping process is performed to form components of the lead frame including a chip loading plate(12), a tie bar, an inner lead(14), and an outer lead by stamping the metal disk by using a punch(41). The lead frame is loaded on an upper surface of a down-set punching die(43). The chip loading plate is punched by using a down-set punch(42). The chip loading plate is inserted into an internal space(44) of the down-set punching die. The chip loading plate is pressed by a burr removal part(45a) of a round type section structure having a curve or a chamfer type section structure having a slope, in order to remove a burr(12a) therefrom.