METHOD OF FABRICATING MULTI-LAYERED PRINTED CIRCUIT BOARD WITH A METAL BUMP

摘要

A method for fabricating a multi-layered printed circuit board with a metal bump is provided to improve reliability and reduce a cost by using the metal bump to connect inner layer substrates to each other. A method for fabricating a multi-layered printed circuit board includes the steps of: preparing a plurality of first inner layer substrates and second inner layer substrates; alternately arranging the first inner layer substrates and the second inner layer substrates in order; inserting adhesive sheets(40) between the first inner layer substrates and the second inner layer substrates; arranging copper foils on outer layers; and laminating a combination of a plurality of the stacked copper foils, adhesive sheets, first inner layer substrates, and second inner layer substrates through vacuum-thermal compression.