| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic substrate and a ceramic substrate which can suppress the increase of facility cost and manufacturing cost, and is hard to give troubles to a post-process. <P>SOLUTION: A base substrate 10' includes dividing grooves 12x, 12y formed along the divided portion of a component side 11, and dividing grooves 14x, 14y formed by laser irradiation along the dividing grooves 12x, 12y in a non-component side 13. Thereby, the beginning position of splitting when in splitting can be fixed and further the end of the splitting can also be controlled. Accordingly, even if substrate constituents are melted and scattered by the application of heat when in the laser irradiation, since they do not adhere to the component side 11, there is no unfavorable influence on the packaging of an electronic part 31 in the post-process. Moreover, since the dividing grooves 12x, 12y formed at a sheet 10 are set so as to have depths which do not generate troubles in the dimensional accuracy of the substrate even if contracted by baking, the position accuracy of the each individual piece 20 before dividing into the individual piece and the dimensional accuracy of the each individual piece 20 after dividing into the each individual piece are not deteriorated. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
