发明名称 |
Solid-state imaging apparatus, manufacturing method therefor and electronic equipment using the same |
摘要 |
Provided is a solid-state imaging apparatus having excellent reading accuracy. The solid-state imaging apparatus of the present invention includes a solid-state imaging element (light receiving element portion) ( 1 a) of a solid-state imaging element chip ( 1 ) mounted on a film ( 11 ), and a resin ( 2 b) having fluidity between the solid-state imaging element chip ( 1 ) and the film ( 11 ), in which the periphery of the resin having the fluidity is sealed with solid-state resins ( 2 a , 14 , etc.) that are said to be sealing members. The resin ( 2 b) having the fluidity eliminates an adverse influence on reading due to waviness on the film surface, and realizes the solid-state imaging apparatus having the excellent reading accuracy.
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申请公布号 |
US2008197437(A1) |
申请公布日期 |
2008.08.21 |
申请号 |
US20080068927 |
申请日期 |
2008.02.13 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
SUGIMOTO TOMONOBU;MAGOI TAKASHI |
分类号 |
H01L31/0232;A61B5/117;G01B11/24;G06T1/00;H01L27/14;H01L31/18 |
主分类号 |
H01L31/0232 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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