<p>A surface mount device (10) having a surface mount foot (20) and a method for making the same is disclosed. The method includes providing a piece of pre-plated conductive stock of a conductive base material and a corrosion-resistant conductive plating material different from the conductive base material at least partially overlying the conductive base material. The stock is cut and formed to create a surface mount device (10) having a surface mount foot (20) extending therefrom. The surface mount foot (20) has a top surface (26), a plated bottom surface (28) and an at least one unplated side surface (24) intermediate the top and bottom surfaces (26, 28). The plated bottom surface (28) is swaged to create a new plated coined edge surface (22) intermediate the unplated side surface (24) and the plated bottom surface (28) of the surface mount foot (20).</p>
申请公布号
WO2008100478(A1)
申请公布日期
2008.08.21
申请号
WO2008US01802
申请日期
2008.02.11
申请人
TYCO ELECTRONICS CORPORATION;HORST, SHELDON, LYNN;WILSON, JOHN, STEVEN