SUBSTRATE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve the problem that pattern collapse and distortion, etc. are caused due to protrusion of a conductive pattern and deviation from a via is caused depending on alignment of an island so that the island is need to be enlarged, it obstructs scale down. SOLUTION: A substrate includes an insulating base material 15 in which a via 18 is formed. Part of a conductive pattern 12 including an island 13 provided with at least an opening 14 is buried in one surface of the insulating base material 15. Another conductive pattern 16 and another island 17 are provided to the other surface of the insulating base material 15. The via 18 is provided while penetrating through the insulating base material 15. The via 18 provided by making penetrate to the conductive pattern 16 and the island 17 formed on the other surface of the insulating base material 15 and the opening of the island 13 are filled with a conductor 20. The conductor 20 is crystallographically bonded and electrically connected to the conductive pattern 12 and the island 13 on one surface of the insulating base material 15 and the conductive pattern 16 and the island 17 formed on the other surface. COPYRIGHT: (C)2008,JPO&INPIT