发明名称 MASK DEFECT INSPECTION METHOD AND MASK DEFECT INSPECTION DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a mask defect inspection method, and a mask defect inspection device used therefor. SOLUTION: This mask defect inspection method of the present invention is provided with a wafer defect inspection device including a defect inspection part for detecting a defect by preparing a mask formed, on a transparent substrate, with a pattern for inspecting a defect, and by obtaining an image based on a light reflected by emitting an illumination light onto a wafer surface, and a wafer stage for mounting a wafer onto the defect inspection part to be opposed to the defect inspection part. The wafer stage is replaced thereafter with a mask stage for supporting the mask in a surface height equivalent to a surface height of the wafer mounted on the wafer stage, and the mask is mounted on the mask stage. The defect inspection part is operated, and an image is acquired by emitting the illumination light onto a mask surface to inspect a mask defect. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008191155(A) 申请公布日期 2008.08.21
申请号 JP20080021343 申请日期 2008.01.31
申请人 HYNIX SEMICONDUCTOR INC 发明人 OH SUNG HYUN;CHOI YONG KYOO;CHO BYUNG SUP
分类号 G01N21/956;G03F1/84;H01L21/66 主分类号 G01N21/956
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