发明名称 |
Diode laser assembly and method for producing such an assembly |
摘要 |
A laser bar having an emitter is placed between the heat sinks bonded using insulating layer forming monolithic heat sink array. The laser bar is electrically connected to the heat sinks. The sub mounts bonded to the heat sinks are provided on either sides of the laser bar. A compensating layer is applied to the surface of the heat sink array (6). A cooling channel (11) is formed between the inner layers of the heat sink. An independent claim is also included for diode laser array manufacturing method. |
申请公布号 |
EP1959528(A2) |
申请公布日期 |
2008.08.20 |
申请号 |
EP20080002400 |
申请日期 |
2008.02.08 |
申请人 |
LASERLINE GESELLSCHAFT FUER ENTWICKLUNG UND VERTRIEB VON DIODENLASERN MBH;CURAMIK ELECTRONICS GMBH |
发明人 |
SCHULZ-HARDER, DR. JÜRGEN;MEYER, DIPL.-ING. ANDREAS;KRAUSE VOLKER;ULLMANN, CHRISTOPH |
分类号 |
H01S5/024;H01L23/473;H01S5/022;H01S5/40 |
主分类号 |
H01S5/024 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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