发明名称 Diode laser assembly and method for producing such an assembly
摘要 A laser bar having an emitter is placed between the heat sinks bonded using insulating layer forming monolithic heat sink array. The laser bar is electrically connected to the heat sinks. The sub mounts bonded to the heat sinks are provided on either sides of the laser bar. A compensating layer is applied to the surface of the heat sink array (6). A cooling channel (11) is formed between the inner layers of the heat sink. An independent claim is also included for diode laser array manufacturing method.
申请公布号 EP1959528(A2) 申请公布日期 2008.08.20
申请号 EP20080002400 申请日期 2008.02.08
申请人 LASERLINE GESELLSCHAFT FUER ENTWICKLUNG UND VERTRIEB VON DIODENLASERN MBH;CURAMIK ELECTRONICS GMBH 发明人 SCHULZ-HARDER, DR. JÜRGEN;MEYER, DIPL.-ING. ANDREAS;KRAUSE VOLKER;ULLMANN, CHRISTOPH
分类号 H01S5/024;H01L23/473;H01S5/022;H01S5/40 主分类号 H01S5/024
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