INTEGRATED CIRCUIT STRUCTURE WITH SUBSTRATE ISOLATION AND UN-DOPED CHANNEL

摘要

An integrated circuit (IC) structure is provided. The IC structure comprises: a first substrate having a plurality of conductive features formed on the substrate; and a plurality of chips mechanically bonded and electrically coupled to the first substrate. A first chip among the chips has a first bump attached to a first conductive feature among the conductive features. The first bump has an elongated cross-sectional surface unit which is formed on a surface in parallel to a surface of the first substrate. The first substrate and the first chip are bonded to have a configuration where a longitudinal shaft of the first bump is oriented to indicate a center position of the first substrate and indicate the direction deviated from the center position of the first chip.