发明名称 Method and apparatus for a layered thermal management arrangement
摘要 Embodiments of the present invention include an apparatus, method, and system for providing a layered thermal management arrangement. Embodiments of the present invention provide a layered thermal management arrangement, including a plurality of first channels, one or more flow-regulation features having a first and second manifold to provide and regulate at least a portion of a first fluid flow to the plurality of first channels and to drain at least the portion of the first fluid flow from the plurality of first channels. Other embodiments may be described and claimed.
申请公布号 US7414843(B2) 申请公布日期 2008.08.19
申请号 US20050077634 申请日期 2005.03.09
申请人 INTEL CORPORATION 发明人 JOSHI YOGENDRA;WEI XIAOJIN;PATTERSON MICHAEL K.
分类号 H05K7/20;F28D15/00;H01L23/34 主分类号 H05K7/20
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