| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad excellent in polishing speed and in-plane uniformity of the polished surface, in which occurrence of scratch on the polished surface of an article to be polished is suppressed sufficiently. <P>SOLUTION: The chemical mechanical polishing pad is provided with, in its polishing surface, a plurality of grooves in the shape of dashed-line extending from the central part toward the peripheral part. The grooves in the shape of dashed-line is linear and preferably consists of a group touching other group in the central part on the polishing surface and a group not touching other group in the central part on the polishing surface. <P>COPYRIGHT: (C)2008,JPO&INPIT |
