| 摘要 |
The invention is directed to enhancement of reliability and a yield of a semiconductor device by a method of manufacturing the semiconductor device with a supporting body (6) without making the process complex. A second insulation film (9), a semiconductor substrate (1), a first insulation film (2), and a passivation film (4) are etched and removed in this order using a resist layer or a protection layer (20) as a mask. By this etching, an adhesive layer (5) is partially exposed in an opening (21). At this time, a number of semiconductor devices are separated in individual semiconductor dies. Then, a solvent (25) (e.g. alcohol or acetone) is supplied to the exposed adhesive layer (5) through the opening (21) to gradually reduce its adhesion and thereby a supporting body (6) is removed from the semiconductor substrate (1). |
