| 摘要 |
A semiconductor device manufacturing apparatus includes a first supporting unit; a first brush configured to brush and clean a substrate fixed to the first supporting unit; a second supporting unit; and a second brush configured to brush and clean the substrate fixed to the second supporting unit. The first supporting unit rotates in a state that the wafer is fixed to the first supporting unit. The second supporting unit comprises a roller configured to contact a peripheral portion of the wafer and to rotate the wafer, and the first supporting unit and the second supporting unit approach to and separate from each other.
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