| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad excellent in polishing speed and in-plane uniformity of polished surface, in which occurrence of scratch is suppressed sufficiently on the polished surface of an article to be polished. <P>SOLUTION: The chemical mechanical polishing pad has a polishing surface consisting of a plurality of regions having a plurality of linear grooves extending in parallel wherein at least one linear groove in each region reaches the end of the polishing surface and the directions of the linear grooves in two adjoining regions are different from each other. <P>COPYRIGHT: (C)2008,JPO&INPIT |
