| 摘要 |
<p>A semiconductor device having a pad whose strength to the contact of a probe needle is increased. The semiconductor device comprises a semiconductor substrate, a semiconductor element formed on the semiconductor substrate, an insulating film formed above the semiconductor substrate and covering the semiconductor element, a multilayer wiring structure formed in the insulating film and a pad electrode structure connected to the multilayer wiring structure and formed on the insulating film. The pad electrode structure includes a conductive adhesive film, a conductive pad electrode formed above the conductive adhesive film and a conductive hydrogen barrier film formed above the conductive pad electrode.</p> |
