| 摘要 |
In a method for the placement of electronic components (1) onto a substrate (2) at a placement station (3), the component bearing by a bearing side (4) on a supply station (5) is picked up by a primary tool (6a, 6b) and transported by a rotational movement to a provision plane (7) lying above the plane of the supply station (5). The component, in the provision plane, is then removed from the primary tool by means of a turning device (9) and turned and transferred to a secondary tool (8) in such a way that it can be deposited onto the substrate once again by the same bearing side. The turning device (9) can be driven by an operating position into a rest position, so that operation without inverse turning is also possible, the secondary tool (8) accepting the components directly from the primary tool (6a, 6b). |
