ALIGNING APPARATUS, BONDING APPARATUS AND ALIGNING METHOD

摘要

An aligning apparatus by which relative positional shift of electronic components can be corrected surely and alignment precision of them can be enhanced, and a bonding apparatus equipped with the aligning apparatus, and an aligning method. Since an imaging port (21) is projecting inward from the outer surface of a chamber (3) to define a space section (1), an image recognition apparatus (47) can be prevented from interfering with movement of the chamber (3) even when the chamber (3) moves together with a second block member (28) by arranging the image recognition apparatus (47) in the space section (11). Consequently, the chamber (3) can be freely moved without limitation. Since one of a first block member (12) or the second block member (28) can be freely moved relatively to the other without being restricted by the arrangement of the image recognition apparatus (47), alignment of a first wafer and a second wafer held, respectively, by the first block member (12) and the second block member (28) can be carried out surely.