发明名称 Method of applying a radiation cured resin with a transparent, removable overlay
摘要 A process of using a transparent overlay device with a resin for repairing a small hole in a pipe includes applying an adhesive resin to a transparent overlay; applying the adhesive resin to a pipe surface over a hole and curing the adhesive resin through the application of a light source.
申请公布号 US7410667(B2) 申请公布日期 2008.08.12
申请号 US20050294330 申请日期 2005.12.06
申请人 MEDHESIVES, INC. 发明人 EISENHUT ANTHONY R.;EISENHUT ERIC D.
分类号 B05D3/06 主分类号 B05D3/06
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