发明名称 |
Method of applying a radiation cured resin with a transparent, removable overlay |
摘要 |
A process of using a transparent overlay device with a resin for repairing a small hole in a pipe includes applying an adhesive resin to a transparent overlay; applying the adhesive resin to a pipe surface over a hole and curing the adhesive resin through the application of a light source.
|
申请公布号 |
US7410667(B2) |
申请公布日期 |
2008.08.12 |
申请号 |
US20050294330 |
申请日期 |
2005.12.06 |
申请人 |
MEDHESIVES, INC. |
发明人 |
EISENHUT ANTHONY R.;EISENHUT ERIC D. |
分类号 |
B05D3/06 |
主分类号 |
B05D3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|