| 摘要 |
A radiation curing composition is provided to improve radiation curing property, adhesion, releasability, residual film rate, pattern shape, coating property and etching property. A radiation curing composition comprises 50-99 wt% of a cationic polymerizable monomer; a photo cationic polymerization initiator; 0.001-5 wt% of at least one selected from a fluorine-based surfactant, a silicon-based surfactant and a fluorine and silicon-based surfactant; 1 wt% or less of an organic solvent; and 0.5 wt% or less of a colorant, wherein 10 wt% or more of the cationic polymerizable monomer is a compound having an oxetane ring. Preferably the cationic polymerizable monomer comprises a vinyl ether compound and a compound having an oxetane ring. |
