APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF WAFERS

摘要

In an apparatus for electrochemically processing wafers, a supplemental virtual electrode counteracts an electric field offset relative to the wafer resulting from misalignment between the wafer and the anode in the vessel. The apparatus may include an agitator having an elongated agitator element(s) with a first end attached to a first support and a second end attached to a second support. A motor is coupled to the first support and not the second support to drive the agitator along a linear path. A linear guide is engaged with the second support to guide the motion of the agitator. A robotic in a processing system includes a position sensor located to identify a rotational orientation of the wafer while the wafer is carried by an end effector on the robot. The rotational orientation of the wafer is corrected by appropriately moving articulatable links of the robot device, and/or by rotating a rotor support holding the workpiece for processing at a process chamber. The system may include an enclosure positioned around magnets to chemically isolate the magnets from process chemicals. A shield may be positioned between the magnets and the motion path of the robot, magnetically conductive return paths positioned near to the magnet, and/or shields positioned around the motors used in the system, to reduce magnetic interference.