| 发明名称 |
Au-Sn ALLOY BUMP HAVING NO TRAPPED-IN LARGE VOID AND PROCESS FOR PRODUCING THE SAME |
| 摘要 |
An Au-Sn alloy bump that does not include large voids and a method of producing the same are provided. The An Au-Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix. |
| 申请公布号 |
EP1953811(A1) |
申请公布日期 |
2008.08.06 |
| 申请号 |
EP20050811709 |
申请日期 |
2005.11.29 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
ISHIKAWA, MASAYUKI;KOHINATA, MASAYOSHI;MISHIMA, AKIFUMI |
| 分类号 |
H01L21/60;C22C5/02 |
主分类号 |
H01L21/60 |
| 代理机构 |
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| 主权项 |
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