发明名称 |
PLASMA PROCESS UNIFORMITY ACROSS A WAFER BY CONTROLLING A VARIABLE FREQUENCY COUPLED TO A HARMONIC RESONATOR |
摘要 |
A method of processing a workpiece in a plasma reactor chamber includes coupling RF power via an electrode to plasma in the chamber, the RF power being of a variable frequency in a frequency range that includes a fundamental frequency f. The method also includes coupling the electrode to a resonator having a resonant VHF frequency F which is a harmonic of the fundamental frequency f, so as to produce VHF power at the harmonic. The method controls the ratio of power near the fundamental f to power at harmonic F, by controlling the proportion of power from the generator that is up-converted from f to F, so as to control plasma ion density distribution.
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申请公布号 |
US2008182418(A1) |
申请公布日期 |
2008.07.31 |
申请号 |
US20070733858 |
申请日期 |
2007.04.11 |
申请人 |
COLLINS KENNETH S;HANAWA HIROJI;RAMASWAMY KARTIK;BUCHBERGER DOUGLAS A;RAUF SHAHID;BERA KALLOL;WONG LAWRENCE;MERRY WALTER R;MILLER MATTHEW L;SHANNON STEVEN C;NGUYEN ANDREW;CRUSE JAMES P;CARDUCCI JAMES;DETRICK TROY S;DESHMUKH SUBHASH;SUN JENNIFER Y |
发明人 |
COLLINS KENNETH S.;HANAWA HIROJI;RAMASWAMY KARTIK;BUCHBERGER DOUGLAS A.;RAUF SHAHID;BERA KALLOL;WONG LAWRENCE;MERRY WALTER R.;MILLER MATTHEW L.;SHANNON STEVEN C.;NGUYEN ANDREW;CRUSE JAMES P.;CARDUCCI JAMES;DETRICK TROY S.;DESHMUKH SUBHASH;SUN JENNIFER Y. |
分类号 |
H01L21/302;H01L21/461 |
主分类号 |
H01L21/302 |
代理机构 |
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