METHOD FOR FABRICATING A LIGHT EMITTING DIODE PACKAGE

摘要

A method for manufacturing a light emitting diode package is provided to improve the light extraction efficiency by using an unevenness pattern forming apparatus that is rotated. A cup-type package structure(220) is prepared. A groove is formed on an upper surface of the cup-type package structure and a light emitting diode chip is mounted on a bottom surface of the groove. An encapsulant is injected into the groove to form an encapsulation section. A stamp(300) and the cup-type package structure are mounted in a rotatable unevenness forming apparatus(100) so as to face an upper surface of the encapsulation section to an unevenness section. The stamp has the unevenness section on one surface thereof. The unevenness forming apparatus is rotated. An attachment section is formed on an inner side of the unevenness forming apparatus. The cup-type package structure is attached to the attachment section of the unevenness forming apparatus.