| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a component built-in substrate capable of incorporating as many electronic components as possible in the substrate. <P>SOLUTION: The base material of the plate-like resin 23 is impregnated with thermo-setting resin. The plate-like resin 23 is so stacked on a wiring board 22 that a hole 31 formed in the plate-like resin 23 encloses an electronic component 2. Then, the hole 31 provided to the plate-like resin 23 is filled with the thermo-setting paste-like resin 25. Then, a surface layer wiring part 5 is so stacked as to cover paste-like resin 25. By hot pressing in this condition, the region where the electronic component 2 can be mounted is enlarged, thereby a component built-in substrate 21 in which many electronic components 2 are built in is achieved. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
