| 发明名称 |
LOW INDUCTANCE BOND-WIRELESS CO-PACKAGE FOR HIGH POWER DENSITY DEVICES, ESPECIALLY FOR IGBTS AND DIODES |
| 摘要 |
<p>A power semiconductor package that includes at least two semiconductor devices electrically coupled to one another through a common metallic web.</p> |
| 申请公布号 |
WO2007120769(A3) |
申请公布日期 |
2008.07.31 |
| 申请号 |
WO2007US09037 |
申请日期 |
2007.04.13 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION;HAUENSTEIN, HENNING, M. |
发明人 |
HAUENSTEIN, HENNING, M. |
| 分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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