Method and apparatus for a microactuator bonding pad structure for solder ball placement and reflow joint

摘要

An apparatus and method for a microactuator having a bonding pad having a solder ball retainer to decrease instances of solder ball movement. The method provides a substrate for the microactuator. A conductive layer above the substrate is provided. A bonding pad having a solder ball retainer is provided and disposed above the conductive layer. The bonding pad having a solder ball retainer provides reduced instances of movement of a solder ball disposed therewithin prior to and during a reflow process performed on the solder ball.