发明名称 METHOD FOR FORMING CHALCOGENIDE FILM AND METHOD FOR MANUFACTURING RECORDING ELEMENT
摘要 <p>This invention provides a method for forming a chalcogenide film within a contact hole formed in an insulating layer on a substrate. The method comprises the step of providing a target having the same composition as the chalcogenide film, the step of setting an L/T ratio to not less than 0.5 and not more than 1.5, wherein T represents the diameter of the target, m, L represents the distance between the target and the substrate, m, and the step of forming a chalcogenide film within the contact hole by a sputtering process wherein a bias electric power is applied to the substrate to apply a sputtering electric power to the target.</p>
申请公布号 WO2008090963(A1) 申请公布日期 2008.07.31
申请号 WO2008JP51001 申请日期 2008.01.24
申请人 ULVAC, INC.;KIKUCHI, SHIN;NISHIOKA, YUTAKA;KIMURA, ISAO;JIMBO, TAKEHITO;SUU, KOUKOU 发明人 KIKUCHI, SHIN;NISHIOKA, YUTAKA;KIMURA, ISAO;JIMBO, TAKEHITO;SUU, KOUKOU
分类号 H01L27/105;C23C14/34;H01L45/00 主分类号 H01L27/105
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