| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where an increase of manufacture cost or chipping of a semiconductor chip is suppressed, and also to provide a manufacturing method of the semiconductor device. SOLUTION: The semiconductor device and the manufacturing method of the device has processes of: dividing an off substrate 10 so that first faces S1 and S2 of the semiconductor device having an operation layer 18, which is installed on the off substrate 10, become first cleavage faces; and dividing the off substrate 10 so that second faces S3 and S4 crossing the first faces S1 and S2 of the semiconductor device become substantially vertical to a surface of the off substrate rather than a second cleavage face of the off substrate 10. COPYRIGHT: (C)2008,JPO&INPIT |
