| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated semiconductor package with a means capable of effectively cooling only the intensive heat generating portion of any one of semiconductor chips making up the semiconductor package. <P>SOLUTION: The semiconductor package 10 is made by laminating a plurality of semiconductor chips 11, 12, and 13. On at least the semiconductor chip 12 out of the semiconductor chips, the heat generating portion 12A heated at a relatively high temperature is exposed locally, and is brought into contact with a heat sink member 17 to directly cool the heat generating portion 12A. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
