| 摘要 |
PROBLEM TO BE SOLVED: To resolve problems, wherein when a MEMS assembly in which a MEMS chip and a silicon-made cap chip are jointed is resin-casted, wires move and contact with a side of the silicon-made cap chip, thereby generating noises and line short circuiting. SOLUTION: The side of the silicon-made cap chip is formed by wet etching, and an insulation protecting film is formed on the wet-etched surface, thereby forming the insulation protecting film having a high adhesion force; whereby even if wires moves and come into contact with a cap chip side at resin-molding, generation of noises and line short circuiting can be prevented. COPYRIGHT: (C)2008,JPO&INPIT |
