Production of a solder connection between an optical element and a support element comprises arranging a solder in a joining region between the optical element and the support element and further processing

摘要

Production of a solder connection between an optical element (2) and a support element (3) comprises arranging a solder (10) in a joining region between the optical element and the support element, arranging a resistance element (5) in the joining region and producing an electrical current flow through the resistance element to form heat to melt the solder and to produce a solder connection between the optical element and the support element. Independent claims are also included for the following: (1) Optical component group with the optical element and support element; and (2) Assembly arrangement containing the above component group.