| 发明名称 |
SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER |
| 摘要 |
A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.
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| 申请公布号 |
US2008173992(A1) |
申请公布日期 |
2008.07.24 |
| 申请号 |
US20070778427 |
申请日期 |
2007.07.16 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
MAHLER JOACHIM;YONG WAE CHET;DORAISAMY STANLEY JOB;DEML GERHARD;FISCHER RUPERT;ENGL REIMUND |
| 分类号 |
H01L21/00;H01L23/02;H01L23/495 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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