| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a protective structure in which a fragile member, such as a semiconductor wafer, is held stably when transferred or ground on its back face, etc., and is separated without being damaged after having been subjected to a necessary process. <P>SOLUTION: According to the protective structure of the fragile member, the fragile member is fixed separably to a thin plate via a double-face adhesive tape. The bending strength of the thin plate is 20 to 2,000 MPa, and the bending distortion of the thin plate is 1% or more. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
