发明名称 |
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
A semiconductor device package includes a semiconductor device mounted and electrically coupled to a substrate, a package body encapsulating the semiconductor device against a portion of an upper of the substrate; and an electromagnetic interference shielding layer formed over the package body and substantially enclosing the semiconductor device. The present invention further provides methods for manufacturing the semiconductor device package.
|
申请公布号 |
US2008174013(A1) |
申请公布日期 |
2008.07.24 |
申请号 |
US20080038621 |
申请日期 |
2008.02.27 |
申请人 |
YANG JUN YOUNG;JOO YOU OCK;JUNG DONG PIL |
发明人 |
YANG JUN YOUNG;JOO YOU OCK;JUNG DONG PIL |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|