| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition for adhesives which can provide a good coating surface without adjusting its viscosity using an organic solvent, can temporarily adhere to an adherend by ultraviolet irradiation for adhesion, is capable of positioning and release of adherends, then shows increased adhesiveness at an ordinary temperature or by heating, and finally strongly adheres to the adherends. <P>SOLUTION: The curable resin composition for adhesives comprises a hydroxy group-containing urethane (meth)acrylate (A) prepared by reacting a diol compound (a1) having a molecular weight of 1,000-7,000, a polyisocyanate compound (a2), and a hydroxy group-containing (meth)acrylate compound (a3), a monomer having an ethylenically unsaturated double bond (B), a polyisocyanate compound (C), and a photoinitiator (D). <P>COPYRIGHT: (C)2008,JPO&INPIT |
